PCB circuit board copper foil basic knowledge

Brief Introduction of 1. Copper Foil

Copper foil (copper foil): a negative electrolytic material, a thin, continuous layer of metal foil deposited on the substrate of the circuit board, which serves as the conductor of the PCB. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after etching. Copper mirror test: A flux corrosion test that uses a vacuum deposited film on a glass plate.

The copper foil is made of copper and a certain proportion of other metals. Generally, there are two kinds of copper foil: 90 foil and 88 foil, that is, the copper content is 90% and 88%, and the size is 16*16cm. Copper foil is the most widely used decorative material. Such as: hotels, monasteries, Buddhist statues, gold-lettered signboards, tile mosaics, handicrafts, etc.

Titanium 2. product characteristics

Copper foil has low surface oxygen characteristics, can be attached to a variety of different substrates, such as metal, insulating materials, etc., with a wide range of temperature use. Mainly used in electromagnetic shielding and antistatic, the conductive copper foil is placed on the substrate surface, combined with the metal substrate, has excellent conductivity, and provides the effect of electromagnetic shielding. Can be divided into: self-adhesive copper foil, double-conducting copper foil, single-conducting copper foil, etc.

Electronic grade copper foil (purity over 99.7, thickness 5um-105um) is one of the basic materials in the electronic industry. The electronic information industry is developing rapidly. The use of electronic grade copper foil is increasing. Its products are widely used in industrial calculators, communication equipment, QA equipment, lithium ion batteries, civil televisions, video recorders, CD players, photocopiers, telephones, air conditioners, electronic components for automobiles, game consoles, etc. The demand for electronic grade copper foil, especially high-performance electronic grade copper foil, is increasing in domestic and foreign markets. Relevant professional institutions predict that by 2015, the domestic demand for electronic grade copper foil in China will reach 300000 tons, and China will become the largest manufacturing place for printed circuit boards and copper foil bases in the world. The market for electronic grade copper foil, especially high-performance foil, is promising.

Global supply status of 3. copper foil.

The copper foil for industrial use can be commonly divided into two categories: rolled copper foil (RA copper foil) and point solution copper foil (ED copper foil). Among them, rolled copper foil has better ductility and other characteristics, which is the copper foil used in the early soft board process, while electrolytic copper foil has the advantage of lower manufacturing cost than rolled copper foil. Since rolled copper foil is an important raw material for soft boards, the improvement of the characteristics and price changes of rolled copper foil have a certain impact on the soft board industry.

Because there are fewer manufacturers of rolled copper foil, and the technology is also in the hands of some manufacturers, so the customer's grasp of the price and supply is low, so in the premise of not affecting product performance, with electrolytic copper foil instead of rolled copper foil is a feasible solution. However, if the physical properties of the copper foil itself will affect the etching factors in the next few years, in the thin or thin products, in addition to high-frequency products due to telecommunications considerations, the importance of rolled copper foil will increase again.

There are two major obstacles to the production of rolled copper foil, resource obstacles and technical obstacles. The obstacle of resources refers to the production of rolled copper foil needs to be supported by copper raw materials, and it is very important to occupy resources. On the other hand, technical barriers to more new entrants, in addition to calendering technology, surface treatment or oxidation treatment technology is also. Most of the world's largest manufacturers have many technology patents and key technologies Know How, increasing barriers to entry. If the new entrants to post-processing production, but also by the cost of large factories, not easy to successfully join the market, so the global rolling copper foil is still a strong exclusive market.

The development of the 4. copper foil.

English is an important material for electrodepositedcopperfoil, copper clad laminate (CCL) and printed circuit board (PCB) manufacturing. In today's rapid development of electronic information industry, electrolytic copper foil is called: electronic products signal and power transmission, communication "neural network". Since 2002, the production value of China's printed circuit board has entered the third place in the world, and copper clad laminate, as the substrate material of PCB, has also become the third largest producer in the world. As a result, China's electrolytic copper foil industry has developed by leaps and bounds in recent years. In order to understand and understand the world and the development of China's electrolytic copper foil industry in the past, present, and look forward to the future, according to the China Epoxy Resin Industry Association experts review its development.

From the perspective of the production department and market development of the electrolytic copper foil industry, its development process can be divided into three major development periods: the period when the United States created the initial world copper foil enterprise and the electrolytic copper foil industry started.